报告人:Daniel CW Tsang,Hong Kong Polytechnic University
时间:2019年3月27日(周三)上午10:30-11:30
地点:能源楼206
Daniel CW Tsang, Associate Professor
Department of Civil and Environmental Engineering
Faculty of Construction and Environment
Hong Kong Polytechnic University
Hung Hom, Kowloon, Hong Kong
Tel:+852-2766-6072
Email:dan.tsang@polyu.edu.hk
Dr. Daniel Tsang is currently an Associate Professor in the Department of Civil and Environmental Engineering at the Hong Kong Polytechnic University (HK PolyU). He was an IMETE Visiting Scholar at Ghent University in Belgium (2015), Visiting Scholar at Stanford University in the US (2011-2013), Senior Lecturer (2011-2012) and Lecturer (2008-2010) at the University of Canterbury in New Zealand, and Post-doctoral Fellow at Imperial College London in the UK (2007-2008) and the Hong Kong University of Science and Technology (2006-2007). Dan holds BEng (2002) and PhD (2006) from the Hong Kong University of Science and Technology. Dan has been active at idea exchange through journal publications and professional service in both academia and industry.
With a strong link to real-world environmental challenges, Dan’s research group strives to develop cost-effective and low-impact solutions to ensure sustainable urban development, enhance the engineering infrastructure, and create new ways in which we manage contaminated soils/sediments, municipal solid waste, and urban waters. Dan has published over 200 SCI journal papers, and serves as Associate EditorofScience of the Total Environment,Associate Editor ofCritical Reviews in Environmental Science and Technology,Editorial Board Member ofChemosphere, Editorial Board Member ofBioresource Technology, Subject Editor ofJournal of Soils and Sediments, and Coordinating Editor ofEnvironmental Geochemistry and Health. Danis chair and organizer of 2ndBiological Wasteas ResourceConference (BWR2017, Hong Kong), 4thContaminatedLand,EcologicalAssessment andRemediationConference (CLEAR2018, Hong Kong),and3ndInternational Conference onBioresources, Energy, Environment, and MaterialsTechnology (BEEM2019, Hong Kong).